This year the GS Nanotech enterprise, a part of the innovation cluster Technopolis GS, Kaliningrad region, was the first in Russia to launch commercial microprocessor under SiP technology (System-in-Package) mass production. The new GS Nanotech SiP Amber S2 microcircuit was fully developed by the GS Nanotech R&D Department. The enterprise itself is the country’s largest microelectronic product development and manufacturing center and the only back-end facility that provides multi-chip design and packaging using SiP technology on a contract basis.
Students of Petrozavodsk State University, Faculty of Physical Engineering, undertook an internship at GS Nanotech, a microelectronic product development and manufacturing center, which is a part of the innovation cluster Technopolis GS (the town of Gusev, Kaliningrad region). Educational process held from September 1 to October 12, 2014 was carried out within the collaboration agreement concluded between GS Nanotech and the educational institution this year.
GS Nanotech, microelectronics products development and manufacture center, plans to launch mass assembly of 3D stacked TSV (through-silicon via) microcircuits in next few years. GS Nanotech intends to be in line with the world leaders of microelectronics industry. The company does not disclose the total investments in the project, but it will include the cost of hardware, software, and staff training.
Contract manufacturing opportunities of companies that make up Technopolis GS innovation cluster were presented March 27 in Moscow at New Electronics, the largest exhibition devoted to electronics design and manufacturing in Russia.
In mid-November 2013 representatives of GS Nanotech visited the XX Productronica trade fair in Munich. In course of the exhibition company managers contacted partners and got to know about some latest technological innovations in electronics.